Tender Detail

Buyer/Seller : Can be viewed by Subscribers |
TOI : 90437294
Requirement : Supply, deliver, install and commission of a photonic chip-to-chip automatic precision alignment system for hybrid laser integration to school of electrical & electronic engineering
Tender description : Tenders are invited for Supply, deliver, install and commission of a photonic chip-to-chip automatic precision alignment system for hybrid laser integration to school of electrical & electronic engineering Opportunity Amount: 500.00 USD Response Deadline: 16 Dec 2025, 15:59
Company Industry: Education And Research Institute

Key values

Tender Estimated cost : USD 500
Closing date : 16/12/2025
Location : Singapore - Not Classified

Tender Documents

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